- reactive deposition
- реактивное осаждение
Солнечная энергия. - М.: «Руссо».. под ред. Д.С. Стребкова. 2005.
reactive deposition
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Vacuum deposition — Not to be confused with Vacuum coating. Vacuum deposition is a family of processes used to deposit layers atom by atom or molecule by molecule at sub atmospheric pressure (vacuum) on a solid surface. The layers may be as thin as one atom to… … Wikipedia
Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… … Wikipedia
Electron beam physical vapor deposition — or EBPVD is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous… … Wikipedia
Electron beam physical vapor deposition — Traduction à relire Electron beam physical vapor deposition → … Wikipédia en Français
Thin-film deposition — is any technique for depositing a thin film of material onto a substrate or onto previously deposited layers. Thin is a relative term, but most deposition techniques allow layer thickness to be controlled within a few tens of nanometers, and some … Wikipedia
Combustion chemical vapor deposition — (CCVD) is a chemical process by which thin film coatings are deposited onto substrates in the open atmosphere. Contents 1 History 2 Principles and procedure 3 Remote combustion chemical v … Wikipedia
Chemical vapor deposition — DC plasma (violet) enhances the growth of carbon nanotubes in this laboratory scale PECVD apparatus. Chemical vapor deposition (CVD) is a chemical process used to produce high purity, high performance solid materials. The process is often used in … Wikipedia
Pulsed laser deposition — (PLD) is a thin film deposition (specifically a physical vapor deposition, PVD) technique where a high power pulsed laser beam is focused inside a vacuum chamber to strike a target of the desired composition. Material is then vaporized from the… … Wikipedia
Deep reactive-ion etching — (DRIE) is a highly anisotropic etch process used to create deep penetration, steep sided holes and trenches in wafers, with aspect ratios of 20:1 or more. It was developed for microelectromechanical systems (MEMS), which require these features,… … Wikipedia
Electrophoretic deposition — (EPD), is a term for a broad range of industrial processes which includes electrocoating, cathodic electrodeposition, and electrophoretic coating, or electrophoretic painting. A characteristic feature of this process is that colloidal particles… … Wikipedia
Cathodic arc deposition — or Arc PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique is can be used to deposit a… … Wikipedia
